Photo by Chester Ho from Unsplash

Gov’t proposes a $500b borrowing ceiling for bond schemes

The government will move the resolution to the legislative council on 17 March.

The government proposed a resolution to set a combined borrowing ceiling of $500m for the Government Green Bond Programme and the Infrastructure Bond Programme (IBP).

The government will also expand the scope of the Government Green Bond Programme and rename it the Government Sustainable Bond Programme (GSBP) to promote Hong Kong as a green and sustainable finance hub.

Meanwhile, the government will establish the IBP to enable better cash flow management and faster completion of infrastructure projects.

The government believes that this ceiling will allow more flexibility in quota reallocation.

The government will move the resolution to the legislative council on 17 March.

Follow the link for more news on

Join Hong Kong Business community